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Programs : Brochure

This page is the brochure for your selected program. You can view the provided information for this program on this page and click on the available buttons for additional options.
  • Locations: Osaka, Japan; Sendai, Japan; Tokyo, Japan; Tsukuba, Japan
  • Program Terms: EAP Fall, EAP Year (academic)
  • Select for specific program info:
    Homepage:
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  • This program is currently not accepting applications.
Dates / Deadlines:

There are currently no active application cycles for this program.
Fact Sheet:
Fact Sheet:
Language of instruction: English, Japanese Housing options: Private apartments, University-affiliated residences
Program: Immersion (exchange), International school Class standing required at departure: Graduate, Junior, Senior, Sophomore
Areas of study: Anthropology, Biological sciences, Mechanical engineering Minimum GPA from application until departure: 3
Minimum language GPA: 3 Click here for a definition of this term Passport Required at Time of Application: No
Program Description:

You will list your host university preferences in the EAP application. Host university placement is based on your major, intended course work, and Japanese language ability.




This program is currently not accepting applications.